基于EMIF總線接口的橋芯片設(shè)計(jì)
2023年電子技術(shù)應(yīng)用第1期
沈婧,陶青平,強(qiáng)小燕
中國電子科技集團(tuán)公司第五十八研究所,江蘇 無錫 214035
摘要: EMIF是DSP(數(shù)字信號(hào)處理器)器件上的外部存儲(chǔ)接口,基于TMS320VC5510電路的EMIF接口,提出了一種橋芯片的設(shè)計(jì)方法。該橋芯片包含了多個(gè)低速外設(shè)如I2C、UART以及SDIO接口,同時(shí)集成了IDO、ADC模擬IP,設(shè)計(jì)進(jìn)行了充分的EDA仿真和FPGA驗(yàn)證,并進(jìn)行了流片驗(yàn)證,實(shí)裝測試結(jié)果表明EMIF接口可與橋芯片通信無誤,實(shí)現(xiàn)了TMS320VC5510電路的外設(shè)擴(kuò)展功能。該橋芯片的設(shè)計(jì)方法大大增加了市場上SoC設(shè)計(jì)的靈活度,有效地降低了設(shè)計(jì)周期,節(jié)約了設(shè)計(jì)成本。
中圖分類號(hào):TN402
文獻(xiàn)標(biāo)志碼:A
DOI:10.16157/j.issn.0258-7998.222892
中文引用格式: 沈婧,陶青平,強(qiáng)小燕. 基于EMIF總線接口的橋芯片設(shè)計(jì)[J]. 電子技術(shù)應(yīng)用,2023,49(1):36-40.
英文引用格式: Shen Jing,Tao Qingping,Qiang Xiaoyan. Design of bridge chip based on EMIF bus interface[J]. Application of Electronic Technique,2023,49(1):36-40.
文獻(xiàn)標(biāo)志碼:A
DOI:10.16157/j.issn.0258-7998.222892
中文引用格式: 沈婧,陶青平,強(qiáng)小燕. 基于EMIF總線接口的橋芯片設(shè)計(jì)[J]. 電子技術(shù)應(yīng)用,2023,49(1):36-40.
英文引用格式: Shen Jing,Tao Qingping,Qiang Xiaoyan. Design of bridge chip based on EMIF bus interface[J]. Application of Electronic Technique,2023,49(1):36-40.
Design of bridge chip based on EMIF bus interface
Shen Jing,Tao Qingping,Qiang Xiaoyan
NO.58 Rerearch Institute of China Electronics Technology Group Corporation, Wuxi 214035,China
Abstract: EMIF is an external storage interface on a DSP (digital signal processor) device, and this paper proposes a bridge chip design method based on the EMIF interface of the TMS320VC5510 circuit. The bridge chip contains low-speed peripherals I2C, UART and SDIO interface, while integrating IDO, ADC analog IP. This design has been fully EDA simulation and FPGA verification, and tapeout for silicon verification. The implementation test results show that the EMIF interface can communicate with the bridge chip without error, and realize the peripheral expansion function of the TMS320VC5510 circuit. The design method of this bridge chip greatly increases the flexibility of SoC design on the market, effectively reduces the design cycle, and saves design costs.
Key words : EMIF;DSP;bridge chip;silicon verification;SoC design
0 引言
DSP是固件系統(tǒng)重要的核心技術(shù),又加之嵌入式的基礎(chǔ)技術(shù),使其再次成為了現(xiàn)代電子應(yīng)用技術(shù)的重要核心技術(shù)之一。
TMS320VC5510是常用的高性能低功耗定點(diǎn)數(shù)字信號(hào)處理器電路(下文簡稱C55x DSP),片上EMIF接口是一個(gè)并行存儲(chǔ)接口,設(shè)計(jì)初衷是實(shí)現(xiàn)DSP與不同類型的外部擴(kuò)展存儲(chǔ)之間的連接[1]。為了使得DSP資源得到最大的擴(kuò)展,本文利用EMIF總線接口設(shè)計(jì)了一款A(yù)SIC橋芯片。該芯片將EMIF時(shí)序轉(zhuǎn)換為片內(nèi)AMBA總線的AHB/APB時(shí)序,從而實(shí)現(xiàn)DSP對(duì)ASIC片內(nèi)資源的訪問[2]。
本文詳細(xì)內(nèi)容請下載:http://m.viuna.cn/resource/share/2000005073。
作者信息:
沈婧,陶青平,強(qiáng)小燕
(中國電子科技集團(tuán)公司第五十八研究所,江蘇 無錫 214035)
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